TLY-3 2-Layer 20mil Silver-Gold Plate PCB for Millimeter Wave Applications
1.Introduction
TLY-3 laminates are manufactured with very lightweight woven fiberglass and are much more dimensionally stable than chopped fiber reinforced PTFE composites. The woven matrix in the TLY-3 material yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.
Comparative OEM testing at 77 GHz of lightly reinforced TLY-3 vs. its closest chopped fiber reinforced competitor has shown "drop in"/equivalent insertion losses/dielectric properties. The primary benefit is much higher manufacturing yields. The dielectric constant range is 2.17 to 2.40. For most thicknesses, the dielectric constant can be specified anywhere within this range with a tolerance of +/-0.02. In the low dielectric constant range, the dissipation factor is approximately 0.0009 at 10 GHz. Typical applications include satellite communications, automotive radar, filters, couplers, avionics and phased array antennas.
2.Key Features
Ultra-Low Dielectric Constant: 2.33 ±0.02 at 10GHz
Exceptional Signal Integrity: Dissipation Factor of 0.0012 at 10GHz
Thermal Management: Thermal Conductivity of 0.22 W/mk (Unclad)
Dimensional Stability: x CTE 26 ppm/°C, y CTE 15 ppm/°C, z CTE 217 ppm/°C
Strong Bonding: Peel Strength 0.5oz 11 lbs/in, 1oz 17 lbs/in
Environmental Resistance: Low Moisture Absorption of 0.02%
Safety Certified: Flammability Rating of V-0
Space Qualified: Outgassing TML 0.01%, CVCM 0.01%, WVR 0.01%
3.Benefits
Manufacturing Excellence: Dimensionally Stable for high volume production
Superior RF Performance: Lowest Df for millimeter wave applications
Mechanical Reliability: High Peel Strength
Environmental Durability: Low Moisture Absorption
Consistent Performance: Uniform, Consistent Dk
Advanced Processing: Laser Ablatable for precision manufacturing
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | TLY-3 |
| Layer Count | 2-layer |
| Board Dimensions | 125mm × 47mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 0.6mm |
| Finished Cu Weight | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Silver plate / gold plate (Gold over silver) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper Layer 1 - 35μm (1oz)
TLY-3 Core - 20mil (0.508mm)
Copper Layer 2 - 35μm (1oz)
6.PCB Statistics:
Components: 25
Total Pads: 86
Thru Hole Pads: 64
Top SMT Pads: 22
Bottom SMT Pads: 0
Vias: 31
Nets: 2
7.Typical Applications
Automotive Radar (77GHz)
Satellite/Cellular Communications
Power Amplifiers
LNBs, LNAs, LNCs
Aerospace Systems
Ka, E and W band Applications
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
